Application - Training Reflow Soldering - Basics
Please fill in the application. Deadline is 2 weeks before beginning of the training.
Terms of application
Number of participants: min. 3 / max. 8 people
In case of overbooking the registrations will be considered in order of their entry.
After receiving your application we will send as a confirmation the invoice. The invoice has to be paid before the training is starting.
Deregistration with credit of the fee is possible (less Euro 30.00 handling charge) latest 1 week before the seminar. For later deregistration the full amount has to be paid.
It's SMT's right to cancel the seminar on short notice with full credit of the fee.
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Events
- SMT Training - Reflow Soldering
Dates 2011 - 25. - 27.04.2012
Nepcon Shanghai, China - 28.02. - 01.03.2012
IPC Apex Expo, San Diego, California - USA, Booth 2641 - 11. - 13.04.2012
ExpoElectronica 2012 Moscow, Russia - 08. - 10.05.2012
SMT/HYBRID/PACKAGING in Nuremberg, booth 9-203
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