Vacuum Soldering Systems

  1. Voids will be reduced up to 99%, solder joints quality optimized
  2. Double sided PCBs
  3. Suitable for PCBs, DCB, stamping grid and carrier
  4. Setting Parameter: evacuation time; vacuum hold time; ventilation time; vacuum pressure
  5. Only one sealing surface of the vacuum chamber

"Vacuum Plus" is a system for improving quality of solder joints. Voids are reduced in a vacuum chamber which significantly improves the quality of the soldered product.



Vacuum S

Heating zone 2598 mm

Vacuum M

Process area length 4326 mm

Vacuum L

Process area length 5432 mm

Vacuum L Plus

Process area length 6392 mm