Vacuum-Soldering-System

Inline Vacuum Reflow Soldering System

The modular set-up allows to combine heating zones with variable length, different Vacuum chambers, transport systems and cooling zones. The system is individually adjustable on throughput and product range. The system can solder with or without Vacuum process combined with nitrogen or oxygen.


Vacuum S

Heating zone 2598 mm

Vacuum M

Process area length 4326 mm

Vacuum L

Process area length 5432 mm

Vacuum L Plus

Process area length 6392 mm