Milestones

  • Foundation of SMT company by Hans-Günter Ulzhöfer in 1987
  • First Reflow soldering systems based on IR-radiation technology
  • First full convection-reflow-soldering systems in 1994
  • Patent of the revolutionary “Slot Nozzle System” to optimize
  • heat transmission in 1995
  • Patent of “Double Peak Method” for further optimation of heat transmission especially for difficult PCBs in 1997
  • Presentation of a new product generation with intention and target „lowest operation costs in power and nitrogen consumption“ and highest availability in 2000
  • Presentation of the technical unique „ABS process gas cleaning system“ in 2003
  • Market introduction of the intelligent nitrogen control and measurement system to stabilize the ppm-levels in different operating modes and reduction of operation costs in 2003
  • Totally new development of the „Power Nozzle Systems“ in 2004 as our answer to higher requirements related to heat transmission in the age of lead-free soldering processes.
  • In 2007 amendment of the established product range of reflow soldering systems for „frontend area“ by the product range of HTT systems for the „backend area“
  • April 2008 Opening of the American branch, SMT North America, Inc., in Glen Allen, Richmond, VA
  • Construction of plant 3 in 2008
  • Opening of the new technology centre in plant 4 in September 2008
  • August 2009 Incorporation of SMT-AP Pte. Ltd. in Singapore
  • SMT Wertheim has been awarded the 2010 VISION Award in the category of Soldering Equipment “Best New Product” for the SMT Vacuum Plus N2 system.
  • 2010 SMT Wertheim has been awarded the Global Technology Award in the category “Soldering Equipment”