For PCBs with normal size and weight a temperature between 60 °C and 80 °C can be realized without a cooling aggregate. For heavy or bigger PCBs an additional cooling aggregate with closed circulation is optional. With the included cooling zone control unit the gradient can be adjusted. Water supply with or without pressure is possible.
Our multilevel cooling zone (max. 5 stages possible) is completely separated from the heating zones. Due to the perfect heat distribution and airflow within the oven the temperature exchange between the heating zone and cooling zone is limited.
This results in a smooth cooling of the PCB.
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Events
- SMT Training - Reflow Soldering
Dates 2011 - 25. - 27.04.2012
Nepcon Shanghai, China - 28.02. - 01.03.2012
IPC Apex Expo, San Diego, California - USA, Booth 2641 - 11. - 13.04.2012
ExpoElectronica 2012 Moscow, Russia - 08. - 10.05.2012
SMT/HYBRID/PACKAGING in Nuremberg, booth 9-203
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