Bulk heads reduce the opening down to the minimum: the width of the PCB, reduction of nitrogen and power consumption and clear temperature separation of the zones. Each zone can be separately adjusted. At the Peak zone we use a SMT patented power nozzle system which guarantees a perfect temperature distribution.
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Events
- SMT Training - Reflow Soldering
Dates 2011 - 25. - 27.04.2012
Nepcon Shanghai, China - 28.02. - 01.03.2012
IPC Apex Expo, San Diego, California - USA, Booth 2641 - 11. - 13.04.2012
ExpoElectronica 2012 Moscow, Russia - 08. - 10.05.2012
SMT/HYBRID/PACKAGING in Nuremberg, booth 9-203
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