SMT‘s new development. The reliable oxygen analyser, suitable for operation with contaminated process gases. This analyser uses a l –probe. It‘s the first system which offers the required durability and accuracy. The gas should be withdrawn where the soldering process take place. At the peak zone on the same level of the PCB and not at the entrance of the nitrogen.
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Events
- SMT Training - Reflow Soldering
Dates 2011 - 25. - 27.04.2012
Nepcon Shanghai, China - 28.02. - 01.03.2012
IPC Apex Expo, San Diego, California - USA, Booth 2641 - 11. - 13.04.2012
ExpoElectronica 2012 Moscow, Russia - 08. - 10.05.2012
SMT/HYBRID/PACKAGING in Nuremberg, booth 9-203
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