Reduction of voids in the solder joint results in:
- Increased thermal conductivity
- Low component temperature
- Increased durability of components
In high-frequency applications the width of impedance of the solder joint is optimized (narrow). The vote performance of the components is thereby simplified.
The solder of the component is melted, the component goes in the vacuum chamber via the inline conveyor system. Because of the vacuum application voids will be sucked out of the solder joint. Process parameter are adjustable: evacuation, holding and venting time as well as reached vacuum. Then the component goes into the cooling zone where the solder is solidified.